尼克森微電子股份有限公司-產品新訊

產品新訊

2018-11-22

WLCSP - Lighter, Thinner, Best Solution for Battery Application

The WLCSP(Wafer Level Chip Scale Product) is a whole new package technique for power switches and space limited application demands. This product is mainly optimized by the increase of utilization ratio on a package and by reduction of the impedance of the package. Furthermore, it also provides a stable and reliable support for many forms of application. It definitely can satisfy the demands of mainstream product in the market, especially the battery power management system or any miniaturization application in the future.

NIKO-SEM WLCSP MOSFET is designed by 0.18 um technology on the wafer size of 8 inches. NIKO has its own complete product quality test regulation to make sure after fab-out, the chips are all reliable and well-performed.

Select WLCSP for your application:

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