Product News
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2018-11-22
WLCSP - Lighter, Thinner, Best Solution for Battery Application
The WLCSP(Wafer Level Chip Scale Product) is a whole new package technique for power switches a...more
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2018-11-22
Advanced Gate Technique - Extremely low Q_G(gate charge)
A new structure for middle/low voltage optimizes or depresses ringing effect, shoot-through and...more
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2018-11-22
AC-DC Total Solution – High Voltage and High Conversion Efficiency
Niko has been dedicated to developing discrete power MOSFET for several years from low voltage ...more
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2018-11-22
PowerFET – Cooler, smaller, Good Choice for Motherboard
The new type of package technique makes MOSFET cooler than ever. With lower temperature as the ...more
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2018-11-22
Dual-Die – 2 in 1 Integration Package Technique
A brand new concept, convenient for customer layout design and the component placement. The ...more
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2017-11-10
N+P MOSFET – PK609CA.
PK609CA is a N-ch + P-ch Complementary solution, build in two MOSFETs into one package. Compare...more
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2017-07-11
CSP N-MOSFET –PQ5L6JN.
PQ5L6JN is a Common Drain, 4L2B CSP(4 Line, 2 Ball, Chip Size Package) package solution. Compar...more
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2017-04-17
Low Ron P-MOSFET –PKC76BB.
PKC76BB is a Copper-Chip package solution. Compared Copper-clip and traditional MOSFET, it grea...more
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2017-03-15
CSP N-MOSFET –PQ5L2JN.
PQ5L2JN is a Common Drain, 4L2B CSP(4 Line, 2 Ball, Chip Size Package) package solution. Compar...more
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2017-02-15
Dual N(Asymmetric) Vcore Soultion –PKC50DY.
PKC50DY is a Copper-Clip dual N package solution. Compared Copper-clip and traditional dual MOS...more
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